J-STD-033D处理包装运输和使用湿度回流和过程敏感设备.docx

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1、JOINT INDUSTRY STANDARDIPC/JEDEC J-STD-033DApril 2018Supersedes IPC/JEDEC J-STD-033C-1 August 2014Downloaded by Harlan Jack (txsjd666) on Oct 20, 2023, 12:42 am PDTHandling, Packing, Shipping and Use of Moisture,Reflow, and Process Sensitive DevicesNoticeJEDEC and IPC Standards and Publications are

2、designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existen

3、ce of such Standards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those ot

4、her than JEDEC and IPC members, whether the standard is to be used either domesticallyor internationally.Recommended Standards and Publications are adopted by JEDEC andIPC without regard to whether their adoption may involve patents on articles, materials, or processes. By such action, JEDEC and IPC

5、 do not assume any liability to any patent owner, nor do they assume any obligation whateverto parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement.The material in this joint st

6、andard was developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the IPC Plastic Chip Carrier Cracking Task Group (B-10a)For Technical Information Contact:JEDECSolid State Technology Association 3103 North 10th Street, Suite 240-S Arlington, VA 22201-2107Tel 7

7、03 907.0026Fax 703 907.7501IPC3000 Lakeside Drive, Suite 105N Bannockburn, Illinois60015-1249Tel 847 615.7100Fax 847 615.7105Please use the Standard Improvement Form shown at the end of this document.Copyright 2018. JEDEC Solid State Technology Association, Arlington, Virginia, and IPC, Bannockburn,

8、 Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of

9、 the United States.IPC/JEDEC J-STD-033DHandling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive DevicesA joint standard developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPCSuperse

10、des:IPC/JEDEC J-STD-033C-1 -August 2014IPC/JEDEC J-STD-033C -February 2012 IPC/JEDEC J-STD-033B.1includes Amendment 1 - January 2007IPC/JEDEC J-STD-033B -October 2005Users of this publication are encouraged to participate in the development of future revisions.Contact:IPC/JEDEC J-STD-033A -July 2002

11、IPC/JEDEC J-STD-033 -April 1999 JEDEC JEP124IPC-SM-786A -January 1995IPC-SM-786 - December 1990JEDECSolid State Technology Association 3103 North 10th Street, Suite 240-S Arlington, VA 22201-2107Tel 703 907.0026Fax 703 907.7501IPC3000 Lakeside Drive, Suite 105 N Bannockburn, Illinois60015-1249Tel 84

12、7 615.7100Fax 847 615.7105This Page Intentionally Left BlankApril 2018IPC/JEDEC J-STD-033DAcknowledgmentAny document involving a complex technology draws material from a vast number of sources across many continents. While the principal members of the Plastic Chip Carrier Cracking Task Group (B-10a)

13、 of the Packaged Electronic Components Committee (B-10) are shown below, it is not possible to include all of those who assisted in the evolution of this standard. To each of them, the members of the IPC extend their gratitude.Plastic Chip Carrier Cracking Task GroupChairmanSteven R. Martell Nordson

14、 SonoscanJEDEC JC 14.1 CommitteeChairman Ife HsuIntel CorporationJoint Moisture Classification Working Group MembersJoseph Kane, BAE Systems Platform SolutionsMudasir Ahmad, Cisco Robert DiMaggio, Clariant Mark Reese, Clariant Francis Classe, CypressChris Brigham, Evans Analytical Group Mark Burns,

15、Global FoundriesShi Dan Bing, Huawei Guo Fujan, Huawei Jiao Huifang, HuaweiRuss Lewis, Hewlett-Packard Curtis Grosskopf, IBM Corporation Andreas Preussger, InfineonDennis Cerney, Infineon Ife Hsu, Intel Corporation Alan Lucero, Intel Gautam Verma, IntelKen McGhee, JEDEC Perry Keller, Keysight Ash Ku

16、mar, Microchip Dongie Xie, NvidiaBob Knoell, NXP Semiconductors Nicholas Lycoudes, NXPSemiconductorsStevan Hunter, On Semi Mumtaz Bora, PeregrineSemiconductorRichard Iodice, Raytheon Company Jinhwan Kim, SamsungHeon Sang Lim, Samsung Mian Quddus, SamsungMichelle Ogihara, Seika Machinery Inc. Steven

17、Martell, Sonoscan Inc.James Berry, Texas Instruments Larry Ting, Texas InstrumentsStephen Tisdale, Tisdale Environmental ConsultingBruce Hughes, US ArmyAdditionally, we would like to express our appreciation to the JEITA members for their support in improving J-STD-033 rev D.In MemoriumThe Joint Com

18、mittee would like to especially acknowledge Jack T. McCullen and Richard L. Shook for their outstanding contributions and leadership in the development of J-STD-033.iiiThis Page Intentionally Left BlankApril 2018IPC/JEDEC J-STD-033DTable of Contents1 FOREWORD11.1 Purpose11.2 Scope11.3 Assembly Proce

19、sses11.3.1 Mass Reflow11.3.2 Localized Heating11.3.3 Socketed Devices11.3.4 Point-to-Point Soldering11.3.5 Aqueous Cleaning11.4 Reliability21.5 Terms and Definitions21.5.1 Active Desiccant21.5.2 Bar Code Label21.5.3 Bulk Reflow21.5.4 Carrier21.5.5 Desiccant21.5.6 Floor Life21.5.7 Humidity Indicator

20、Card (HIC)21.5.8 Manufacturers Exposure Time (MET)21.5.9 Moisture-Barrier Bag (MBB)21.5.10 Moisture-Sensitive Identification (MSID)21.5.11 Moisture-Sensitivity Level (MSL)21.5.12 Rework21.5.13 Process-Sensitivity Level (PSL)21.5.14 Shelf Life (of a device in a sealed MBB)21.5.15 SMD31.5.16 Solder Re

21、flow31.5.17 Water Vapor Transmission Rate (WVTR)32 APPLICABLE DOCUMENTS (Normative)32.1 American Society for Testing and Materials (ASTM)32.2 Electronic Industries Alliance (ECIA, JEDEC)32.3 IPC Standards32.4 Joint Industry Standards32.5 Department of Defense33 DRY PACKING33.1 Requirements33.2 Dryin

22、g of SMD Packages and Carrier Materials Before Being Sealed in MBBs43.2.1 Drying Requirements - Levels 2a - 5a43.2.2 Drying Requirements for Carrier Materials43.2.3 Drying Requirements43.2.4 Excess Time Between Bake and Bag43.3 Dry Pack43.3.1 Description43.3.2 Materials43.3.3 Labels63.3.4 Moisture B

23、arrier Bag Sealing73.3.5 Dry-Pack Precautions73.3.6 Shelf Life84 DRYING84.1 Post Exposure to Factory Ambient104.1.1 Any Duration Exposure104.1.2 Short Duration Exposure104.2 General Considerations for Baking114.2.1 High Temperature Carriers114.2.2 Low Temperature Carriers114.2.3 Paper and Plastic Co

24、ntainer Items114.2.4 Bakeout Times114.2.5 ESD Protection114.2.6 Reuse of Carriers114.2.7 Solderability Limitations115 USE115.1 Incoming Bag Inspection115.1.1 Upon Receipt115.1.2 Device Inspection125.2 Floor Life125.3 Safe Storage125.3.1 Dry Pack125.3.2 Shelf Life125.3.3 Dry Atmosphere Cabinet125.4 R

25、eflow125.4.1 Opened MBB125.4.2 Reflow Temperature Extremes125.4.3 Additional Thermal Profile Parameters135.4.4 Multiple Reflow135.4.5 Maximum Reflow Passes135.5 Drying Indicators135.5.1 Excess Humidity in Dry Pack135.5.2 Floor Life or Ambient Temperature/Humidity Exceeded . 13 5.5.3Level 6 SMD Packa

26、ges136 BOARD REWORK136.1 Device Removal, Rework and Remount136.1.1 Removal for Failure Analysis146.1.2 Removal and Remount146.2 Baking of Populated Boards14vIPC/JEDEC J-STD-033DApril 20187 DERATING DUE TO FACTORYENVIRONMENTAL CONDITIONS14APPENDIX ATest Method for Reversible (Type 1)RH Spots on a Hum

27、idity Indictor Card (HIC) used with Electronic Device Packaging16APPENDIX BDerivation of Bake Tables17APPENDIX CDesiccant Unit Absorption CapacityTest Method for Verification18APPENDIX DChanges in J-STD-033D19FiguresFigure 3-1Typical Dry-Pack Configuration for Moisture-Sensitive SMD Packages in Ship

28、ping Tubes4Figure 3-2A Humidity Indicator Card (HIC) Type 15Figure 3-2B Humidity Indicator Card (HIC) Type 25Figure 3-3Moisture-Sensitive Identification Label(Examples)6Figure 3-4A Caution Label (Examples with MSL only)7Figure 3-4B Caution Label (Examples with MSL and PSL)7Figure 3-5MBB with No Evac

29、uation (Example)8Figure 3-6MBB with Recommended Light Air Evacuation (Example)8Figure 3-7MBB with Too Much (Full) Evacuation(Example)8Figure A-1Photo of Testing Apparatus16TablesTable 3-1Dry-Packing Requirements4Table 3-2Typical Reversible (Type 1) HIC SpotCompliance6Table 4-1Reference Conditions fo

30、r Drying Mounted or Unmounted SMD Packages9Table 4-2Supplier Bake: Default Baking Times UsedPrior to Dry Pack10Table 4-3Resetting or Pausing the Floor-Life Clockat User Site10Table 5-1Moisture Classification Level (MSL) andFloor Life per J-STD-02012Table 7-1Recommended Equivalent Total FloorLife (da

31、ys) 20 C, 25 C & 30 C, 35 C For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reflow at same temperature at which the device was classified)Maximum Percent Relative Humidity15viApril 2018IPC/JEDEC J-STD-033DHandling, Packing, Shipping and Use of Moisture, Reflow,and Process Sensitive Devic

32、es1 FOREWORDThe advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage such as cracks and delamination from the solder reflow process. This document describes the standardized levels of floor-life exposure for moisture/reflow sensitive SMDs

33、 along with the handling, packing and shipping requirements necessary to avoid moisture/ reflow related failures. Companion documents J-STD-020, J-STD-075 and JEP113 define the classification procedure and the labeling requirements, respectively.For moisture sensitivity, moisture from atmospheric hu

34、midity enters permeable packaging materials by diffusion. Assembly processes used to solder SMDs to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200 C. During solder reflow, the combination of rapid moisture expansion, materials mismatch, and material inte

35、rface degradation can result in cracking and/or delamination of critical interfaces within the device.Typical solder reflow processes of concern for all devices are convection, convection/IR, infrared (IR), vapor phase (VPR), hot airrework tools, and wave solder, including full immersion.Non-semicon

36、ductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity,flux sensitivity or cleaning process sensitivity.1.1 Purpose The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shippin

37、g, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.

38、By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.1.2 Scope This standard applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic

39、 encapsulated packages, process sensitive devices and other moisture sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.1.3 Assembly Processes1.3.1 Mass Reflow This standard applies to bulk solder reflow assembly by convection, con

40、vection/IR, infrared (IR), and vapor phase (VPR) processes. It does not apply to bulk solder reflow processes that immerse the device bodies in molten solder (e.g., wave soldering bottom mounted devices). Such processes are not allowed for many SMDs and are not covered by the device qualifications s

41、tandards used as a basis for this document.1.3.2 Localized Heating This standard also applies to moisture/reflow sensitive SMD packages that are removed or attachedsingly by local ambient heating, i.e., hot air rework. See Clause 6.1.3.3 Socketed DevicesThis standard does not apply to SMD packages t

42、hat are socketed and not exposed to solder reflow temperatures during either bulk reflow or rework of adjacent devices. Such SMD packages are not at risk and do not require moisture precautionary handling.1.3.4 Point-to-Point Soldering This standard does not apply to SMD packages in which only the l

43、eads are heated to reflow the solder, e.g., hand-soldering, hot bar attach of gull wing leads, and through hole by wave soldering. The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount reflow or hot air rework and moisture precautionary measur

44、es are typically not needed.1.3.5 Aqueous Cleaning For non-cavity SMDs typical short term aqueous cleaning processes will not impact the floor life(internal moisture content). Special consideration should be given to non-hermetic cavity packages.1IPC/JEDEC J-STD-033DApril 20181.4 Reliability The met

45、hods set forth in this specification ensure that an adequate SMD package reliability can be achieved during and after the PCB assembly operation, when the SMD packages are evaluated and verified by J-STD-020, J-STD-075, and/or by JESD22-A113 plus environmental reliability testing.Note: This specific

46、ation does not address or ensure solder joint reliability of external interconnects for attached devices.1.5 Terms and Definitions1.5.1 Active Desiccant Desiccant that is either fresh (new) or has been baked according to the manufacturers recommendationsto renew it to original specifications.1.5.2 Bar Code Label A label that includes information in a code consisting of parallel bars and spaces or a 2-D matrix format.Note: For the