常用芯片资料——1462.docx

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1、TDA2822SGS-THOMSONRfflU胤 IBLIBST胤网 DC 国POWERDIP(Plastic 12+2+2)ORDERING NUMBER : TDA2822DUAL POWER AMPLIFIER SUPPLY VOLTAGE DOWN TO 3 V LOW CROSSOVER DISTORSION LOW QUIESCENT CURRENT BRIDGE OR STEREO CONFIGURATIONDESCRIPTIONThe TDA2822 is a monolithic integrated circuit in 12+2+2 powerdip, intended

2、for use as dual audio power amplifier in portable radios and TS sets.TYPICAL APPLICATION CIRCUIT (STEREO)POWERDIP 16 PACKAGE MECHANICAL DATADIM.mminchMIN.TYP.MAX.MIN.TYP.MAX.a10.510.020B0.851.400.0330.055b0.500.020b10.380.500.0150.020D20.00.787E8.800.346e2.540.100e317.780.700F7.100.280I5.100.201L3.3

3、00.130Z1.270.050DA口1!1111111111口pBFlU IIIIIllllIII u LInformation furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties wh

4、ich may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously sup

5、plied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.1995 SGS-THOMSON Microelectronics - All Rights ReservedSGS-THOMSON Microelectronics GROUP OF COMPANIESAus

6、tralia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore-Spain -Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.PIN CONNECTION (top view)INPUT4(2NX.(NPUT(2)GNDGNDDUTPUT(Z)N.C.N.CSCHEMATIC DIAGRAMABSOLUTE MAXIM

7、UM RATINGSSymbolParameterValueUnitVsSupply Voltage15VIoOutput Peak Current1.5APtotTotal Power Dissipation at Tamb = 50 at Tcase = 70 1.254WWTstg, TjStorage and Junction Temperature-40 to 150THERMAL DATASymbolParameterValueUnitRth j-ambFhermal Resistance Junction-ambientMax80/WRthj-caseThermal Resist

8、ance Junction-pinsMax20/WELECTRICAL CHARACTERISTICS (Vs = 6 V, Tamb= 25 , unless otherwise spec币ed) STEREO (test circuit of fig. 1)SymbolParameterTest ConditionMin.Typ.Max.UnitVsSupply Voltage315VVcQuiescent Output VoltageVs = 9 VVs = 6 V42.7VVIdQuiescent Drain Current612mAlbInput Bias Current100nAP

9、oOutput Power (each channel)d = 10 % f = 1 kHz Vs = 9 V Rl = 4 Q Vs = 6 V Rl = 4 QVs = 4.5 V RL = 4 Q1.3 0.451.70.650.32WWWGvClosed Loop Voltage Gainf = 1 kHz363941dBRiInput Resistancef = 1 kHz100kQeNTotal Input NoiseRs = 10 kQB = 22 Hz to 22 kHz Curve A2.5 2MV mVSVRSupply Voltage Rejectionf = 100 H

10、z2430dBCSChannel SeparationRg = 10 kQ f = 1 kHz50dBBRIDGE (test circuit of fig. 2)VsSupply Voltage315VIdQuiescent Drain CurrentRl = 8612mAVosOutput Offset VoltageRl = 8 Q1060mVlbInput Bias Current100nAPoOutput Powerd = 10 % f = 1 kHz Vs = 9 V Rl = 8 Q Vs = 6 V Rl = 8Q Vs = 4.5 V RL = 4 Q2.70.93.21.3

11、51WWWdDistortion (f = 1 kHz)Rl = 8 Q Po = 0.5 W0.2%GvClosed Loop Voltage Gainf = 1 kHz39dBRiInput Resistancef = 1 kHz100kQeNTotal Input NoiseRs= 10 kQB = 22 Hz to 22 kHzCurve A32.5mV mVSVRSupply Voltage Rejectionf = 100 Hz40dBFigure 1 : Test Circuit (stereo).Figure 2 : P.C. Board and Components Layo

12、ut of the Circuit of Figure 1 (1:1 scale).(巴陵。二二aoCA+EUJMod)ONo(cr)N一o-一nI.1%，亲-，.o-浮如壁.&;双割舅蹲Figure 3 : Test Circuit (bridge).Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale).crO002 53Figure 6 : Output Power vs. Supply Voltage (Bridge).Figure 5 : OutputPower vs. Su

13、pply Voltage (Stereo).Figure 7 : Distorsion vs. Output Power (Bridge).Figure 9 : Supply Voltage Rejection vs. Frequency.RLs8n d.io% f S tKHz1Jf/G-614402468 W 124 VFigure 8 : Distorsion vs. Output Power (Bridge).Figure 10 : QuiescentCurrent vs. Supply Voltage.Figure 11 : Total Power Dissipation vs. O

14、utput Power (Stereo).Figure 12 : Total Power Dissipation vs. Output Power (Bridge).Figure 13 : Total Power Dissipation vs. Output Power (Bridge).Figure 14 : Application Circuit for Portable Radios.4MMThe Rthj-ambOf the TDA2822 can be reduced by sol- deringthe GND pins toa suitable copperarea of the

15、printed circuit board (Figure 15) or to an external heatsink (Figure 16).The diagram of Figure 17 shows the maximum dis- sipable power Ptot and the Rthj-ambas a functionof theside 3 oftwoequalsquarecopperareashaving a thickness of 35 p (1.4 mils).Figure 15 : Example of P.C. Board Copper Area which i

16、s used as Heatsink.COPPER AREA 万户 THICKNESSQD 1 PC boardDuring soldering the pins temperature must not exceed 260 and the soldering time must not be longer than 12 seconds.The external heatsink or printed circuit copperarea must be connected to electrical ground.Figure 16 : External Heatsink Mounting Example.IZOrnrn.MOUNTING INSTRUCTIONFigure 6 : Maximum Dissipable Power and Junction to Ambient Thermal Resistance vs. Side 3”.Figure 7 : Maximum Allowable Power Dissipation vs. Ambient Temperature.